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Surface
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Gold plating\HAL\OSP\Gold finger
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Raw Material
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FR4, FR5(High TG), CEM-1, AI-base…
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Max. Board Size
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600mm*800mm
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Min. Board Size
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5mm*5mm
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Warp age
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Single-side<1.0%,Double-side<0.6%,Multilayer<0.6%
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Min. Thickness & Tolerance
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0.2mm+0.08mm
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Min. Line Width / Space & Tolerance
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HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)
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Copper to Edge-board Spacing
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0.5mm (20mil)
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Hole side to Edge-board Spacing
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0.3mm (7.87mil)
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Min. Hole Size & Tolerance
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Size: 0.1mm/4mil(laser hole)
Tolerance: +0.075mm/3mil for PTH Diameter; +0.05mm/2mil for Non-PTH Diameter
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Min. Hole Space & Tolerance
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0.4mm+0.076mm (15.75mil+3mil)
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Hole Wall Thickness
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20-25um (0.79mil-1.0mil)
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Hole Position Deviation
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+0.076mm (+3mil)
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Min. Round Hole Dia.(for Punch)
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1.0mm(40mil) with PCB thickness
1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)
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Min. Square Figure hole Dia.(for Punch)
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0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;
1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)
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Finished Board Size Tolerance
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CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)
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V-cut Position Tolerance
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+0.2mm(+8mil)
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Base Material Thickness
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0.2-3.5mm
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Base Material Copper Thickness
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18um, 35um, 70um
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Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches
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Au: 0.01 to 0.076 micron; Ni: 5~15mm
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Selective Immersion Gold with thickness of 1 to 4 micro inches
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Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm
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Gold tab/finger plating with thickness of 5 to 30 micro inches
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Au: 0.125 to 0.76 micron; Ni: 1.27~12mm
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Electroless Immersion Tin with thickness of 20 to 48 micro inches
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05 to 1.2 micron
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Organic solder ability Preservatives
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Entek Cu 106A HT, Prefulx F2 LX
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