4-Layer OSP PCB Board
- Company Name:HECPCB Electronic Co., LTD
- Membership:Free Member
- Member Since:2011. 11.14
- Country/Region:China
- City:Guangdong
- Contact:Paul Fung
- Related Keywords:osp pcb, PCB manufacturer, green pcb, pcb for rfid products
HECPCB Electronic Co., LTD Contact us
HECPCB Electronic Co., LTD
[China]
We can produce single-sided printed board(ssb), double-sided printed board(dsb), multilayer PCBs, HDI PCBs, FPC and PCBA according to your provided data files or your samples.
HECPCB CAPABILITY-High Volume Conventional PCB
|
Surface |
Gold plating\HAL\OSP\Gold finger |
|
Raw Material |
FR4, FR5(High TG), CEM-1, AI-base… |
|
Max. Board Size |
600mm*800mm |
|
Min. Board Size |
5mm*5mm |
|
Warp age |
Single-side<1.0%,Double-side<0.6%,Multilayer<0.6% |
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Min. Thickness & Tolerance |
0.2mm+0.08mm |
|
Min. Line Width / Space & Tolerance |
HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%) |
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Copper to Edge-board Spacing |
0.5mm (20mil) |
|
Hole side to Edge-board Spacing |
0.3mm (7.87mil) |
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Min. Hole Size & Tolerance |
Size: 0.1mm/4mil(laser hole) Tolerance: +0.075mm/3mil for PTH Diameter; +0.05mm/2mil for Non-PTH Diameter |
|
Min. Hole Space & Tolerance |
0.4mm+0.076mm (15.75mil+3mil) |
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Hole Wall Thickness |
20-25um (0.79mil-1.0mil) |
|
Hole Position Deviation |
+0.076mm (+3mil) |
|
Min. Round Hole Dia.(for Punch) |
1.0mm(40mil) with PCB thickness <FR-4 1.0mm; 1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil) |
|
Min. Square Figure hole Dia.(for Punch) |
0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm; 1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil) |
|
Finished Board Size Tolerance |
CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil) |
|
V-cut Position Tolerance |
+0.2mm(+8mil) |
|
Base Material Thickness |
0.2-3.5mm |
|
Base Material Copper Thickness |
18um, 35um, 70um |
|
Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches |
Au: 0.01 to 0.076 micron; Ni: 5~15mm |
|
Selective Immersion Gold with thickness of 1 to 4 micro inches |
Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm |
|
Gold tab/finger plating with thickness of 5 to 30 micro inches |
Au: 0.125 to 0.76 micron; Ni: 1.27~12mm |
|
Electroless Immersion Tin with thickness of 20 to 48 micro inches |
05 to 1.2 micron |
|
Organic solder ability Preservatives |
Entek Cu 106A HT, Prefulx F2 LX |
HECPCB Factory overview- Equipment list
|
Cut Copper Foil Machine |
Auto.Flash Gold Plating Lineï¼Cu/Ni/Auï¼and line for ï¼Cu/Snï¼ |
|
Cut Prepreg Machine |
Scrubbing Machine (I. S) |
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Scrubbing Machine |
Auto. Printing Machine |
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Auto Cut Sheet Laminator |
Conveyor Oven |
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Exposer |
Electroless Nickel/Gold Plating Line |
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Developer,Etching & Stripping Machine |
Immersion Tin Auto. Line |
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Black Oxide Line & Oven |
Gold –Finger Plating Line |
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Auto. Vacuum Laminator |
Horizontal HAL Machine |
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X-ray Trarget Hole Drilling Machine |
Punching Machine |
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CNC Drilling Machine / Laser drilling machine (Japan) |
CNC Routing Machine |
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Programmer |
Bevelling Machine |
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Registration Drill |
CNC V-cut Machine |
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Drill Sharpener |
E-Tester |
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Auto.Desmear & PTH Line |
Fly Probe Tester |
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Auto. Panel Plating Line |
Organic Coating Line |
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Scrubbing Machineï¼ISï¼ |
Auto.Film Processor |
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Developer |
CAM Stationï¼Orbotech Genesis 2000ï¼ |
We sincerely hope to establish long term and friendly business relationship with your esteemed company. Good quality, reasonable price and the 5-Star service are guaranteed.
Please kindly let us know your requirements.We will give you the best price soon.
HECPCB CAPABILITY-Quick turn
We fully understand that the speed of PCB services is a key element in the product life cycle. We have a quick–turn–around specialists team and special process methods for engineering, production, and logistic. Customer’s time-to-market requirements has driven us to build our service efficiently to meet the client's expectations
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Item |
Sample Delivery Lead Time |
Normal Delivery Lead Time |
||
|
PCB |
Normal |
Special |
Repeat |
New |
|
Single & Double |
4days |
2days |
7-14days |
8-15days |
|
4 layers |
6days |
3days |
8-15days |
9-15days |
|
6 layers |
8days |
4days |
10-16days |
12-18days |
|
8 layers |
10days |
6days |
15-25days |
15-25days |
|
10 layers |
14days |
8days |
16-26days |
16-26days |
|
12 layers |
16days |
10days |
20-28days |
22-30days |
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