Electronic PCB & Pcba

Layers Count:

           2

Material:

FR-4

Aspect ratio:

6:1

Minimum Hole Size:

0.35mm

Minimum Line Width/Space:

0.26mm/0.26mm

Surface Treatment:

lead-free HASL

Board Thickness

2.0mm

Surface

Gold plating\HAL\OSP\Gold finger

Raw Material

FR4, FR5(High TG), CEM-1, AI-base…

Max. Board Size

600mm*800mm

Min. Board Size

5mm*5mm

Warp age

Single-side<1.0%,Double-side<0.6%,Multilayer<0.6%

Min. Thickness & Tolerance

0.2mm+0.08mm

Min. Line Width / Space & Tolerance

HAL PCB: 0.10mm+20% (4mil+20%); Gold PCB: 0.075mm+20% (3mil+20%)

Copper to Edge-board Spacing

0.5mm (20mil)

Hole side to Edge-board Spacing

0.3mm (7.87mil)

Min. Hole Size & Tolerance

Size: 0.1mm/4mil(laser hole)

Tolerance: +0.075mm/3mil for PTH Diameter;  +0.05mm/2mil for Non-PTH Diameter

Min. Hole Space & Tolerance

0.4mm+0.076mm (15.75mil+3mil)

Hole Wall Thickness

20-25um (0.79mil-1.0mil)

Hole Position Deviation

+0.076mm (+3mil)

Min. Round Hole Dia.(for Punch)

1.0mm(40mil) with PCB thickness <FR-4 1.0mm;

1.5mm(59mil) with PCB thickness FR4 1.2-3.0mm (47mil-120mil)

Min. Square Figure hole Dia.(for Punch)

0.8MM x 0.8mm(31.5mil x 31.5mil) with PCB thickness < FR-4 & CEM-3 1.0mm;

1.0mm x 1.0mm(40mil x 40mil) with PCB thickness FR-4 & CEM-3 1.2-3.00mm(47mil-120mil)

Finished Board Size Tolerance

CNC: +0.1mm(+4mil); Punch: +0.15mm(+6mil)

V-cut Position Tolerance

+0.2mm(+8mil)

Base Material Thickness

0.2-3.5mm

Base Material Copper Thickness

18um, 35um, 70um

Electrolytic Flash Gold with thickness of 0.4 to 3.0 micro inches

Au: 0.01 to 0.076 micron; Ni: 5~15mm

Selective Immersion Gold with thickness of 1 to 4 micro inches

Au: 0.025 to 0.1 micron; Ni: 2.54~5.5mm

Gold tab/finger plating with thickness of 5 to 30 micro inches

Au: 0.125 to 0.76 micron; Ni: 1.27~12mm

Electroless Immersion Tin with thickness of 20 to 48 micro inches

05 to 1.2 micron

Organic solder ability Preservatives

Entek Cu 106A HT, Prefulx F2 LX

Cut Copper Foil Machine

Auto.Flash Gold Plating Line(Cu/Ni/Au)and  line for (Cu/Sn)

Cut Prepreg Machine

Scrubbing Machine (I. S)

Scrubbing Machine

Auto. Printing Machine

Auto Cut Sheet Laminator

Conveyor Oven

Exposer

Electroless Nickel/Gold Plating Line

Developer,Etching & Stripping Machine

Immersion Tin Auto. Line

Black Oxide Line & Oven

Gold –Finger Plating Line

Auto. Vacuum Laminator

Horizontal HAL Machine

X-ray Trarget Hole Drilling Machine

Punching Machine

CNC Drilling Machine / Laser drilling machine (Japan)

CNC Routing Machine

Programmer

Bevelling Machine

Registration Drill

CNC V-cut Machine

Drill Sharpener

E-Tester

Auto.Desmear & PTH Line

Fly Probe Tester

Auto. Panel Plating Line

Organic Coating Line

Scrubbing Machine(IS)

Auto.Film Processor

Developer

CAM Station(Orbotech Genesis 2000)